JPS6240848B2 - - Google Patents
Info
- Publication number
- JPS6240848B2 JPS6240848B2 JP14046683A JP14046683A JPS6240848B2 JP S6240848 B2 JPS6240848 B2 JP S6240848B2 JP 14046683 A JP14046683 A JP 14046683A JP 14046683 A JP14046683 A JP 14046683A JP S6240848 B2 JPS6240848 B2 JP S6240848B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- chuck
- rotating
- rotating body
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 85
- 238000001035 drying Methods 0.000 claims description 18
- 235000012431 wafers Nutrition 0.000 description 76
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046683A JPS6032324A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハ乾燥装置 |
| US06/633,134 US4559718A (en) | 1983-08-02 | 1984-07-23 | Method and apparatus for drying semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046683A JPS6032324A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハ乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6032324A JPS6032324A (ja) | 1985-02-19 |
| JPS6240848B2 true JPS6240848B2 (en]) | 1987-08-31 |
Family
ID=15269248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14046683A Granted JPS6032324A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハ乾燥装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032324A (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3590250B2 (ja) * | 1997-11-18 | 2004-11-17 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| KR100382343B1 (ko) * | 2001-03-06 | 2003-05-09 | 엘지전자 주식회사 | 스핀 드라이어 |
| CN101975505B (zh) * | 2010-09-15 | 2012-05-23 | 芜湖天人智能机械有限公司 | 一种偏心甩干装置 |
| JP7235884B2 (ja) * | 2019-10-08 | 2023-03-08 | 株式会社日立ハイテク | 試料ステージ及び光学式検査装置 |
| JP2024126670A (ja) * | 2023-03-08 | 2024-09-20 | 東レエンジニアリング株式会社 | 基板保持装置 |
-
1983
- 1983-08-02 JP JP14046683A patent/JPS6032324A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6032324A (ja) | 1985-02-19 |
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